Median pay
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Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
Strongest O*NET signals first.
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
The measurable national baseline is $51,180 median annual pay, 10.9% projected employment growth from 2024 to 2034, and 3,900 projected openings per year. Use these figures as a national benchmark rather than a personal forecast; location, experience, employer, specialty, credentials, and hours can change individual outcomes.
The national median-pay figure for Semiconductor Processing Technicians is $51,180. Current employment is 31,900, with projected 2034 employment of 35,400. Pay describes the middle worker nationally, not a guaranteed starting salary, and the employment totals describe the occupation's scale rather than the number of jobs available to one applicant.
BLS projects 10.9% employment growth for Semiconductor Processing Technicians from 2024 to 2034 and about 3,900 openings per year. Growth measures whether the occupation is expanding, while annual openings also include replacement needs created when workers retire, change occupations, or leave the labor force.
The typical BLS entry-education category is High school diploma or equivalent. Related work experience is None, and the listed on-the-job training category is Moderate-term on-the-job training. These categories summarize a national pathway; licensing, certification, portfolios, apprenticeships, or local employer requirements may add to it.
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
A representative O*NET task is: Manipulate valves, switches, and buttons, or key commands into control panels to start semiconductor processing cycles. The broader activity profile emphasizes Controlling Machines and Processes, Handling and Moving Objects, Performing General Physical Activities.
The strongest available O*NET skill signals are Critical Thinking, Reading Comprehension, Active Listening. Leading knowledge areas are Production and Processing, English Language, Public Safety and Security. These are national occupational signals, so a specific employer may emphasize a different mix. Examples of software or tools associated with the occupation include Microsoft Excel, Microsoft Office software, Microsoft PowerPoint, Python.
The national median annual pay in the current dataset is $51,180. Actual pay varies by location, experience, employer, specialty, credentials, and hours.
BLS projects 10.9% employment growth from 2024 to 2034 and about 3,900 openings per year. Openings include both newly created positions and replacement demand.
The typical BLS entry-education category is High school diploma or equivalent. Related experience, on-the-job training, licensing, or certification requirements may also apply.
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
BLS provides national pay, employment, and projections. O*NET provides skills, interests, preparation, tasks, work context, and tools.